12 Inch Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring

Product Description:

• Heat treatment process Wafer ring has good resistance to rebound after heat treatment.

• Precision machining precision Wafer Iron Ring using laser cutting machine, cutting error is small.

• Compatible with various packaging devices Compatible with frame processing device (Disco, TSK, ADT, etc.)

Feature:

Advantage:

♦ Adopting heat treatment technology, it has strong bending resistance, toughness and durability, and can be reused repeatedly.

♦ Good adhesion, high flatness, not easy to bubble, good adhesion.

♦ Carefully polished, the surface is smooth and free of burrs, ensuring safe and reliable use.

Application:

• Lon implantation process:The stainless steel tension ring on the wafer can firmly clamp the wafer during ion implantation, allowing it to accurately receive ion beam implantation.

• Manufacturing of battery cells:It can fix the silicon wafer in the corresponding equipment, ensuring the accuracy and consistency of the process.

Laser cutting with high accuracy Surface electropolishing treatment

Packing and Shipping:

Adopt moisture-proof, shock-proof and pressure-proof packing method.

• Choose sturdy cartons, wooden boxes or iron drums and other packaging containers.
• Fill the interior with cushioning materials such as foam, bubble bags,Label the outer package with product information, delivery address, etc.

​Choose a regular international logistics company.

• According to the mode of transportation (sea, air, etc.) to do a good job of storage, loading and unloading
• Maintain temperature and humidity control throughout the transportation of goods. Properly handle the return and exchange of goods due to transportation damage.

Wafer Frame Dicing Cutting Ring

12 Inch Wafer Frame Ring

Wafer Silicon Disk Iron Ring

12 Inch Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring Images